Intel CEO Pat Gelsinger said on Thursday that Intel will invest more than US$7 billion (approximately Rs 53,380 crore) to build a new chip packaging and testing plant in Malaysia to expand production in the country after a global semiconductor shortage.
He said that Malaysia’s new advanced packaging facility is expected to start production in 2024.
The Malaysian government stated that the 30 billion ringgit (approximately Rs 54,140 crore) investment is expected to create more than 4,000 Intel jobs and more than 5,000 construction jobs in the country. Shortages and potential challenges brought by the recovery of the global pandemic,” Malaysia’s Minister of International Trade and Industry Mohamed Azmin Ali said in a statement.
The global shortage of semiconductor chips is partly due to the pandemic driving demand for electronic products and supply chain disruption, causing automakers to cut production and delay the delivery of smartphones from companies such as Apple.
The Malaysian chip assembly industry, which accounts for more than US$20 billion in global trade, has warned that the shortage will last for at least two years.
Complete News Source : Gadgets360
