The Dimensity 1050 SoC from MediaTek is designed for mobile phones. In comparison to older LTE + mmWave chipsets, the marquee feature supports both mmWave 5G and sub-6GHz network frequencies, enabling faster speeds and greater network reach.
The 6nm Dimensity 1050 can combine mmWave 5G and sub-6GHz to migrate between the two bands and deliver speeds that are about 53% faster with greater network coverage, according to the company.
Apart from that, the chipset has two Arm Cortex A78 cores clocked at 2.5GHz and six power efficient cores about which MediaTek is tight-lipped. It has the Mali G-710 GPU from Arm. The SoC can support displays with a refresh rate of 144Hz and up to FHD+ resolution.
The SoC is equipped with the company’s Imagiq 760 ISP and can support up to a 108-megapixel primary camera. Bluetooth 5.3 and Wi-Fi 6E 2×2 are both supported for connectivity. The Dimensity 1050 supports hardware accelerated AV1 decoding, HDR 10+, and Dolby Vision, among other standards.
Apart from the Dimensity 1050, MediaTek also unveiled the Dimensity 930, a successor to the Dimensity 810 with two Cortex A78 cores clocked at 2.2GHz and six Arm A55 efficiency cores clocked at 2.0GHz. It has 120Hz Full HD+ displays, HDR 10+, MiraVision, and Dolby Vision support.
Finally, the Helio G99, a 4G/LTE phone, was announced by the company. According to MediaTek, it is more efficient and performs better than the Helio G96.
Phones with the Dimensity 1050 and Helio G99 SoCs will be available in the third quarter of 2022, while phones with the Dimensity 930 SoC will be available in the second quarter.
