Technology
Intel Teams With Google Cloud to Develop ‘Mount Evans’, a New Class of Data Centre Chip
Intel and Alphabet’s Google Cloud said on Wednesday that they have collaborated to develop a new chip category, which Intel hopes can become a major seller in the booming cloud computing market. This new chip, called Mount Evans, will be sold to companies other than Google, reflecting the way cloud computing providers operate.
They build huge data centers filled with powerful physical computers, and sell virtual slices of these machines to other companies, which in turn are more cost-effective than building their own machines. For cloud providers, tasks such as setting up virtual machines and delivering customer data to the correct location are essentially indirect costs. The Mount Evans chip, which Google and Intel call the “Infrastructure Processing Unit” (IPU), separates these tasks from the main computing tasks and accelerates them. Doing so also helps to ensure that these functions are safe from hacker attacks and increase the flexibility of the data center. “We think this is strategically important.
This is an extremely important area for us and the data center,” Nick McKeown, senior vice president of Intel Networks and Edge Group, told Reuters. Intel is not the only company manufacturing infrastructure chips. Nvidia and Marvell Technology offer similar but slightly different products. But Intel and Google are working together to develop a set of freely released software tools, hoping to make Intel’s version of the chip a more widely used industry standard outside of Google’s data center.
Google researcher and vice president of engineering Amin Vahdat said that Google hopes to inspire a technology trend that makes it easier for all data center operators to flexibly divide physical computer servers into virtual servers to adapt to any computing tasks. “The basic question of what a server is will go beyond the content inside the metal plate. IPU will play a central role there,” Vahdat told Reuters.
News Source : Gadgets 360
Technology
Surfaces of the Motorola Edge 50 Ultra with Snapdragon 8S Gen 3
Early this week, renders of the Edge 50 Fusion appeared, and Motorola has previously stated that the Edge 50 Pro will ship on April 3. The highest-end smartphone in the Edge 50 series, the Edge 50 Ultra, has now been shown in renders.
The phone is depicted in the renderings in peach fuzz and black with a vegan leather finish, while sisal, a beige color, will have a brushed surface. As opposed to the Snapdragon 7 Gen 3 in the Pro variant and the Snapdragon 6 Gen 1 in the Edge 50 Fusion, the phone is reportedly powered by the Snapdragon 8s Gen 3 SoC.
A 50MP primary camera, an ultra-wide camera, and a periscope telephoto camera with a 5x optical zoom are all included in the Motorola Edge 50 Ultra’s feature set. Additionally, there is a triple LED flash on the right side and a laser autofocus feature above the periscope lens.
Although the phone’s display, battery, and charging specifications are yet unknown, the Edge 50 Pro is said to include 12GB of RAM and support both 50W and 125W wired and wireless charging.
It is anticipated that this will launch as the Motorola X50 Ultra in China. It is unclear if the India launch may be expected on the same day as the rest of the Edge 50 series phones, even if this is scheduled to go official on April 3.
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